Amidst tariffs brawl with US, China is delaying reviews of Qualcomm’s NXP deal and Bain’s acquisition of Toshiba’s chip unit, raising fears both deals may fail (Wall Street Journal)

Amidst tariffs brawl with US, China is delaying reviews of Qualcomm’s NXP deal and Bain’s acquisition of Toshiba’s chip unit, raising fears both deals may fail (Wall Street Journal)

Wall Street Journal:
Amidst tariffs brawl with US, China is delaying reviews of Qualcomm’s NXP deal and Bain’s acquisition of Toshiba’s chip unit, raising fears both deals may fail  —  Qualcomm and Bain Capital are most at risk if the delays scuttle their respective deals  —  BEIJING—China is slowing reviews …

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Amidst tariffs brawl with US, China is delaying reviews of Qualcomm’s NXP deal and Bain’s acquisition of Toshiba’s chip unit, raising fears both deals may fail (Wall Street Journal)